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These functions are shown in figure B. The part of the device which is most susceptible to the applied stress will be the most damaged and will eventually fail. Let us first examine a simple binomial distribution model to know concretely what the normal distribution expresses.

Moreover, we consider the system in figure B. The number of samples is determined according to the limits of the binomial distribution indexes. The reaction rate K using s model is given by the following 002 Unless otherwise specified, use Inspection Standard II.

This is known as the multinomial distribution. Jsi the amount of change in the characteristic value is found to be accelerated by thermal stress, in many cases the Arrhenius chemical reaction kinetics model can be applied to this phenomenon. In general, once a semiconductor device has failed, it cannot be repaired and used again. After n times of tests, jiw one of the results is E1, E2, Using a fixed value, in equation IX, for the number of damages k received before failure, consider the failure distribution function F t1, k as a function of time t1.

## JIS Z 0602:1988

The AQL plan measures the lot whose fraction defective is p1 as having the lowest acceptable quality level.

Chapter 5 – Basic Concepts of Probability. The Weibull chart is useful for analysis of failure mode since observed data are graphed nis the Weibull chart in the shape of an linear expression.

The Gamma distribution is a failure probability density function if failure occurrence is considered to follow the Jix process. This occurs in the case of a surge pulse withstand or mechanical impact test. From one end of the wafer, each portion is inspected with a microscope. Number of pieces accepted. Math Statistics And Probability A.

### A.1 AQL Sampling Table

Hence, results fall into m classes E1, E2, Will not be passed. Regular versus Military Time. Different ways are available for sampling n devices from N devices. The initial value for starting the trial is 0 and we perform N tests.

Such a phenomenon occurs with some probability. By inspecting n randomly sampled devices, x defective devices are detected with the probability fH – geo N, R, n, x. Scale palameter Refer to Figure B.

It is important to note that N no longer denotes the number of tests of Bernoulli trial due to the approximation of the binomial probability distribution to the Poisson distribution. The parameter is the value of m.

This, however, is not equivalent to saying the device lifetime is hours.

### JIS Z – Test methods for flat pallets (FOREIGN STANDARD)

The higher the temperature of the molecules, the higher becomes their energies, and so increasing uis temperature quickens reactions. In chemical reactions, if molecules reach the temperature above which they may react the activation energya reaction occurs.

The area of the wafer surface S is divided into many portions. This probability is described by the binomial probability zz fBin x, n, p.

Subsequent lots are, however, subject to normal inspection. It becomes the determining factor in the life of the device.

We cannot expect that there will be no collision for some time since one has jid occurred. Arrhenius expressed the chemical reaction rate, K, experimentally as follows: Single sampling 2 1. R Lot acceptance rate 1. Here we assume that the phenomenon does not occur twice or more at the same instant, and further that the probability of the phenomenon occurring is constant.

## A.1 AQL Sampling Table

The level of degradation of the device can be expressed as a function of the leakage current i. Number of pieces rejected. By considering the jjs of detecting the first failure at time t, the relation of exponential and geometric distributions can be identified. For the system in figure B.