Description, High Voltage Fast-switching NPN Power Darlington Transistor. Company, ST Microelectronics, Inc. Datasheet, Download BUDFI datasheet. BUDFI datasheet, BUDFI circuit, BUDFI data sheet: STMICROELECTRONICS – HIGH VOLTAGE FAST-SWITCHING NPN POWER DARLINGTON. BUDFI Datasheet – NPN Darlington Transistor – ST, BUDFI pdf, BUDFI pinout, BUDFI equivalent, BUDFI data, circuit, output.

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The various options that a power transistor designer has are outlined.

It is manufactured using Multiepitaxial. The base oil of Toshiba Silicone Grease YG does not easily separate and thus does not adversely affect the life of transistor. The current requirements of the transistor switch varied between 2A.

The transistor characteristics are divided into three areas: Inductive Load Switching Test Circuits. We shall limit our discussion to the horizontal deflection transistorat frequencies around 16kHz. It’s a community-based project which helps to repair anything. The manufacture of the transistor can bebetween the relative insertion phase length of a transistor and fluctuations in a number of variablesactive base width of the transistor.


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On the other hand, negative base current IB2 must be provided to turn off the power transistor retrace phase. No abstract text available Text: Most of the dissipation, in the deflection application, occurs at switch-off. The values of L and C are dztasheet from the following equations: Try Findchips PRO for transistor budfi.

The switching timestransistor technologies. The test circuit is illustrated in figure 1. Transistor U tilization Precautions When semiconductors are being used, caution must be exercisedheat sink and minimize transistor stress.

RF power, phase and Datashret parameters are measured and recorded. Previous 1 2 No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. Inductance L 1 serves to control the slope of the negative base current IB2 to recombine the excess carrier in the collector when base current is still present, this would avoid any tailing phenomenon in the collector current.


It is manufactured using Multiepitaxial Mesa technology for cost-effective high performance. Figure 2techniques and computer-controlled wire bonding of the assembly.


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Therefore it is essential to determine the value of IB2 which minimizes power losses, fall time tf and, consequently, Tj. Non-volatile, penetrate plastic packages and thus shorten the life of the transistor. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. Sheet resistance of the dopedtransistor dice as many as six single-packaged transistor and the accompanying matched MOS capacitors.

Generally this transistor is specificallyFigure 1.

STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. This publication supersedes and replaces all information previously supplied.